CFOG
CFOG bonding is a key process that determines signal stability, electrical reliability, and long-term display performance.
In this workshop, COF (Chip on Film) assemblies are precisely bonded to LCD glass substrates using high-accuracy bonding equipment. The process ensures accurate alignment between the driver IC, flexible film, and glass electrodes, maintaining stable electrical connections across the entire interface.
Bonding parameters such as temperature, pressure, and time are strictly controlled to prevent common defects including open circuits, poor adhesion, or signal inconsistency. Each model follows verified bonding profiles to ensure uniform electrical performance and mechanical stability across batches.
This workshop provides a solid foundation for stable signal transmission, consistent display response, and reliable performance in mass production environments.
Phone/WhatsApp:
+ 86 17722577112
Email:
sales@xsjlcd.com
Company Address:
2601, Unit 1, Building 1, Zhongsheng Zhidi Building, No. 99 Longguan West Road, Gaofeng Community, Dalang Street, Longhua District, Shenzhen, Guangdong Province, China
Factory Address:
Building 30, Phase I, Xinli Kangle Chuangcheng Smart Industrial Park, Huicheng District, Huizhou, Guangdong Province, China
Share to:
Copyright © Shenzhen Senser Optoelectronic Technology Co., Ltd.